KCTK 0201 Thick Film Chip, SMT

Characteristics

Condition

Compliance

Continuous Power

Tolerance

-

±1% & ±5%

Temperature Coefficient

-

±200PPM/°C

Insulation Resistance

Max. Overload voltage for 1minute
(According to IEC-60115-1 4.6)

≥10GΩ

Change in Resistance
- Short time overload


- Endurance


- Damp Heat with load


- Dry Heat


- Bending Strength


- Rapid change in temperature


- Resistance to soldering heat

RCWV*2.5 or Max. overload voltage for 5sec (2sec for high power series).
(According to IEC-60115-1 4.13)
@70±2°C Max. working voltage for 1000hrs with 1.5hrs ON and 0.5hrs OFF.
(According to IEC-60115-1 4.25.1)
@40±2°C,90~95% RH. Max. working voltage for 1000hrs with 1.5hrs ON and 0.5hrs OFF.
(According to IEC-60115-1 4.24)
@+125/+155°C for 1000hrs (According to IEC-60115-1 4.23.2)

Bending once for 5 seconds (According to IEC-60115-1 4.33)

-55°C to +125/+155°C, 5 cycles (According to IEC-60115-1 4.18)

260±5°C for 5 seconds (According to IEC-60115-1 4.18)

± (1% + 0.05Ω) for ± 1% and below.

± (2% + 0.05Ω) for ± 5%.
± (1% + 0.10Ω) for ± 1% and below.

± (2% + 0.10Ω) for ± 5%.
± (1% + 0.10Ω) for ± 1% and below.

± (2% + 0.10Ω) for ± 5%.
± (1% + 0.05Ω) for ± 1% and below.

± (1.5% + 0.Ω) for ± 5%.
± (1% + 0.05Ω) for ± 1% and below.

± (1% + 0.05Ω) for ± 5%.
± (0.5% + 0.05Ω) for ± 1% and below.

± (1% + 0.05Ω) for ± 5%.
± (0.5% + 0.05Ω) for ± 1% and below.

± (1% + 0.05Ω) for ± 5%.

Operating Temperature

Solderability (where applicable)

245±5°C for 3 seconds (According to IEC-60115-1 4.17)

>95%

Voltage Proof

1.42*RCWV (rms) for 1minute (According to IEC-60115-1 4.7)

No breakdown